封装结构的热力可靠性方案
Influence of flip-chip attachment process on IC
Moisture Diffusion\Moisture Stress
Thermal Cycling\Thermal Stresses
Solder Joint Reliability
Shock Analysis
Drop Test
Crack Initiation and Crack Growth
Multi-physics Reliability
Warpage Analysis Model import
Thermal
Stress
Stress and Strain Analysis of Solderball
Additional Solution for the fatigue performance of solderball
3DIC热力设计解决方案
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