Allegro DRC错误代码全解析

   DRC错误代码


代码相关对象说明
单一字符代码
LLine走线
PPin元件脚
VVia贯穿孔
KKeep in/out允许区域/禁止区域
CComponent元件层级
EElectrical Constraint电气约束
JT-Junction呈现T形的走线
IIsland Form被Pin或Via围成的负片孤铜
错误代码前置码说明
WWire与走线相关的错误
DDesign与整个电路板相关的错误
MSoldemask与防焊层相关的错误
错误代码后置码说明
SShape/Stub与走线层的Shape或分支相关的错误
NNot Allowed与不允许的设置相关的错误
WWidth与宽度相关的错误
双字符错误代码
BBBondpad to BondpadBondpad之间的错误
BLBondpad to LineBondpad与Line之间的错误
BSBondpad to ShapeBondpad与Shape 之间的错误
CCPackage to PackagePackage之间的 Spacing 错误
Symbol Soldermask to SymbolSoldermask零件防焊层之间的Spacing 错误
DFDifferential Pair Length Tolerance差分对走线的长度误差过长
Differential Pair Primary Max Separation差分对走线的主要距离太大
Differential Pair Secondary Max Separation差分对走线的次要距离太大
Differential Pair Secondary Max Length差分对走线的次要距离长度过长
DIDesign Constraint Negative Plane Island负片孤铜的错误
EDPropagation-Delay走线的长度错误
Relative-Propagation-Delay走线的等长错误
ELMax Exposed Length走线在外层(TOP&BOTTOM)的长度过长
EPMax Net Parallelism Length-Distance Pair已超过Net之间的平行长度
ESMax Stub Length走线的分支过长
ETElectrical Topology走线连接方式的错误
EVMax Via Count已超过走线使用的VIA的最大数目
EXMax Crosstalk已超过Crosstalk值
Max Peak Crosstalk已超过Peak Crosstalk值
HHHold to Hold Spacing钻孔之间的距离太近
HWDiagonal Wire to Hold Spacing斜线与钻孔之间的距离太近
Hold to Orthogonal Wire Spacing钻孔与垂直/水平线之间的距离太近
IMImpedance Constraint走线的阻抗值错误
JNT Junction Not Allowed走线呈T形的错误
KBRoute Keepin to BondpadBondpad在Keepin之外
Route keepout to BondpadBondpad在keepout之内
Via Keepout to BondpadBondpad在Via Keepout之内
KCPackage to Place Keepin Spacing元件在Place Keepin之外
Package to Place Keepout Spacing元件在Place Keepout之内
KLLine to Route Keepin Spacing走线在Route Keepin之外
Line to Route Keepout Spacing走线在Route Keepout之内
KSShape to Route Keepin SpacingShape在Route Keepin之外
Shape to Route Keepout SpacingShape在Route Keepout之内
KVBBVia to Route Keepin SpacingBBVia在Route Keepin之外
BBVia to Route Keepout SpacingBBVia在Route Keepout之内
BBVia to Via Keepout SpacingBBVia在Via Keepout之内
Test Via to Route Keepin SpacingTest Via在Route Keepin之外
Test Via to Route Keepout SpacingTest Via在Route Keepout之内
Test Via to Via Keepout SpacingTest Via在Via Keepout之内
Through Via to Route Keepin SpacingThrough Via在Route Keepin之外
Through Via to Route Keepout SpacingThrough Via在Route Keepout之内
Through Via to Via Keepout SpacingThrough Via在Via Keepout之内
LBMin Self Crossing Loopback Length
LLLine to Line Spacing走线之间太近
LSLine to Shape Spacing走线与Shape 太近
LWMin Line Width走线的宽度太细
Min Neck Width走线变细的宽度太细
MASoldermask Alignment Error PadSoldermask Tolerance太小
MCPin/Via Soldermask to Symbol SoldermaskPad与Symbol Soldermask之间的错误
MMPin/Via Soldermask to Pin/Via SoldermaskPad Soldermask之间的错误
PBPin to BondpadPin与Bondpad之间的错误
PLLine to SMD Pin Spacing走线与SMD元件脚太近
Line to Test Pin Spacing走线与Test元件脚太近
Line to Through Pin Spacing走线与Through元件脚太近
PPSMD Pin to SMD Pin SpacingSMD元件脚与SMD元件脚太近
SMD Pin to Test Pin SpacingSMD元件脚与Test元件脚太近
Test Pin to Test Pin SpacingTest元件脚与Test元件脚太近
Test Pin to Through Pin SpacingTest元件脚与Through元件脚太近
Through Pin to SMD Pin SpacingThrough元件脚与SMD元件脚太近
Through Pin to Through Pin SpacingThrough元件脚与Through元件脚太近
PSShape to SMD Pin SpacingShape与SMD元件脚太近
Shape to Test Pin SpacingShape与Test元件脚太近
Through Pin to Shape SpacingThrough元件脚与Shape太近
PVBBVia to SMD Pin SpacingBBVia与SMD元件脚太近
BBVia to Test Pin SpacingBBVia与Test元件脚太近
BBVia to Through Pin SpacingBBVia 与Through元件脚太近
SMD Pin to Test Via SpacingSMD Pin与Test Via太近
SMD Pin to Through Via SpacingSMD Pin与Through Via太近
Test Pin to Test Via SpacingTest Pin与Test Via太近
Test Pin to Through Via SpacingTest Pin与Through Via太近
Test Via to Through Pin SpacingTest Via与Through Pin太近
Through Pin to Through Via SpacingThrough Pin与Through Via太近
RCPackage to Hard Room元件在其他的Room之内
REMin Length Route End Segment at 135Degree
Min Length Route End Segment at 45/90Degree
SB135Degree Turn to Adjacent Crossing Distance
90Degree Turn to Adjacent Crossing Distance
SLMin Length Wire Segment
Min Length Single Segment Wire
SNAllow on Etch Subclass允许在走线层上
SOSegment Orientaion
BBBondpad to BondpadBondpad之间的错误
SSShape to ShapeShape之间的错误
TAMax Turn Angle
VBVia to BondpadVia 与Bondpad之间的错误
VGMax BB Via Stagger Distance同一段线的BB Via之间的距离太长
Min BB Via GapBB Via之间太近
Min BB Via Stagger Distance同一段线的BB Via之间的距离太近
Pad/Pad Direct ConnectPad 在另一个Pad 之上
VLBB Via to Line SpacingBB Via与走线太近
Line to Through Via Spacing走线与Through Via太近
Line to Test Via Spacing走线与Test Via太近
VSBB Via to Shape SpacingBB Via与Shape太近
Shape to Test Via SpacingShape 与Test Via太近
Shape to Through Via SpacingShape与Through Via太近
VVBB Via to BB Via SpacingBB Via之间太近
BB Via to Test Via SpacingBB Via与Test Via太近
BB Via to Through Via SpacingBB Via与Through Via太近
Test Via to Test Via SpacingTest Via之间太近
Test Via to Through Via SpacingTest Via与Through Via太近
Through Via to Through Via SpacingThrough Via之间太近
WAMin Bonding Wire LengthBonding Wire 长度太短
WEMin End Segment Length
Min Length Wire End Segment at 135Degree
Min Length Wire End Segment at 45/90Degree
WIMax Bonding Wire LengthBonding Wire 长度太长
WWDiagonal Wire to Diagonal Wire Spacing斜线之间太近
Diagonal Wire to Orthogonal Wire Spacing斜线与垂直/水平线之间的距离太近
Orthogonal Wire to Orthogonal Wire Spacing垂直/水平线之间的距离太近
WXMax Number of Crossing
Min Distance between Crossing
XB135 Degree Turn to Adjacent Crossing Distance
90 Degree Turn to Adjacent Crossing Distance
XDExternally Determined Violation
XSCrossing to Adjacent Segment Distances


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